首頁 >

LED package inspection system specifications

 

Item	Defect Name	Image	Spec
Package	No Package
	Broken / Burr
	FM
Chip	No Chip		can't have
	Ink Chip		6μm*6μm(on the Pad) 80μm*80μm
	Flip		10°
	Offset		80μm
	Rotation		10°
	Broken		16μm
	Epoxy (Outer)		no
	Epoxy (Inner)		6μm
	Epoxy (Inner)		6μm
	Micro Crack		6μm
	Scratch		40μm*40μm(on the Pad) 80μm*80μm(lighten area)
	FM		80μm*80μm
	Broken on Finger		6μm
	Gold		16μm*16μm
	No Ball		can't have
	Offset		in the pad
	Diameter		in the pad
Wire	Ball Thick		13.5μm~22.5μm
	No Wire		can't have
	Open or Lift		can't have
	Wrong		can't have
	Tail		no
	Bent		25μm
	Double		can't have
	Broken		can't have
	Stain		can't have
	Short		can't have
	FM		no

 

友善列印